Patent Assignment
Reel/Frame 064361/0525
Assignment of Assignor's Interest
Recorded: 2023-07-24
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-To-Wafer Bonding Structure and Image Sensor Including the Same
Application:
18/223,788 →
Publication:
US 2024/0204027