Patent Assignment
Reel/Frame 064361/0593
Assignment of Assignor's Interest
Recorded: 2023-07-24
Pages: 6
Assignors
PARK, KITAE
Executed: 2023-06-09
BAEK, SEUNGMIN
Executed: 2023-06-09
LEE, JOOHYUNG
Executed: 2023-06-09
CHO, JUNGHYUN
Executed: 2023-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Application:
18/223,757 →
Publication:
US 2024/0162130