Assignment of Assignor's Interest

Recorded: 2023-07-24 Pages: 4

Assignors

LEE, SEUNGHYUN

Executed: 2023-07-21

LEE, HEESOO

Executed: 2023-07-21

SHIN, YONGMOO

Executed: 2023-07-21

Assignee

JCET STATS CHIPPAC KOREA LIMITED

299, JAYUMUYEOK-RO, JUNG-GU, INCHEON, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Device and Method of Forming an Antenna-in-Package Structure

Application: 18/357,733 →

Publication: US 2025/0038058