Assignment of Assignor's Interest

Recorded: 2023-07-25 Pages: 5

Assignors

YONEDA, SATOSHI

Executed: 2023-06-14

NAMATAME, YUTAKA

Executed: 2023-06-14

SHIBATA, TOMOAKI

Executed: 2023-06-15

ONOZEKI, HITOSHI

Executed: 2023-06-20

Assignees

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

HD MICROSYSTEMS, LTD.

4-25, KORAKU 1-CHOME, BUNKYO-KU, TOKYO, 112-0004, JAPAN

Covered Property (1)

Resin Composition, Method for Producing Semiconductor Device, Cured Product, Semiconductor Device, and Method for Synthesizing Polyimide Precursor

Application: 18/029,102 →

Publication: US 2024/0018306

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.