Patent Assignment
Reel/Frame 064373/0599
Assignment of Assignor's Interest
Recorded: 2023-07-25
Pages: 3
Assignors
LIU, YAN-HONG
Executed: 2019-05-30
YANG, DANIEL M.Y. M.Y.
Executed: 2019-05-30
CHEN, CHE-FU
Executed: 2019-05-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Processing Method