Assignment of Assignor's Interest

Recorded: 2023-07-26 Pages: 6

Assignors

LEE, JIHYUN

Executed: 2023-04-28

LEE, JUNHO

Executed: 2023-04-28

LEE, KANG JOON

Executed: 2023-04-28

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package and Method of Fabricating the Same

Application: 18/226,372 →

Publication: US 2024/0145295