Assignment of Assignor's Interest

Recorded: 2023-07-26 Pages: 3

Assignor

SHIOKAWA, HIROFUMI

Executed: 2023-07-24

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Resin Molded Product

Application: 18/274,347 →

Publication: US 2024/0092057

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.