Patent Assignment
Reel/Frame 064416/0956
Assignment of Assignor's Interest
Recorded: 2023-07-28
Pages: 8
Assignors
MAY, ROBERT ALAN
Executed: 2023-07-28
DARMAWIKARTA, KRISTOF
Executed: 2023-07-27
BOYAPATI, SRI RANGA SAI SAI
Executed: 2023-07-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate