Patent Assignment
Reel/Frame 064425/0367
Assignment of Assignor's Interest
Recorded: 2023-07-28
Pages: 3
Assignor
CHOI, BYUNG-JIN
Executed: 2023-07-28
Assignee
CANON KABUSHIKI KAISHA
30-2, SHIMOMARUKO 3-CHOME, OHTA-KU, TOKYO, 146-8501, JAPAN
Covered Property
(1)
System Including an Array of Bonding Heads and an Array of Die Transfer Seats and a Method of Using the Same