Patent Assignment
Reel/Frame 064432/0073
Assignment of Assignor's Interest
Recorded: 2023-07-31
Pages: 3
Assignors
DAIJIMA, YUTA
Executed: 2023-07-20
NOMOTO, SHUJI
Executed: 2023-07-20
NAKAMURA, AKIHIRO
Executed: 2023-07-21
KOMORI, NAOMITSU
Executed: 2023-07-21
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Element, Printed Wiring Board, and Method for Manufacturing Printed Wiring Board
Application:
18/262,276 →
Publication:
US 2024/0134277
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.