IP Library Assignment 064432/0333
Patent Assignment
Reel/Frame 064432/0333

Assignment of Assignor's Interest

Recorded: 2023-07-31 Pages: 5
Assignors
JIANG, FA-SHEN
Executed: 2018-08-31
LIN, HSING-LIEN
Executed: 2018-08-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Thermal Dispersion Layer in Programmable Metallization Cell
Application: 18/362,041 →
Publication: US 2024/0023464