Patent Assignment
Reel/Frame 064437/0216
Assignment of Assignor's Interest
Recorded: 2023-07-31
Pages: 4
Assignors
LO, YI-CHUAN
Executed: 2020-11-05
MOHANTA, PRAVANSHU
Executed: 2020-11-05
XIE, JIANG-HE
Executed: 2020-11-05
CHEN, CHING YU
Executed: 2020-11-05
CHEN, MING-TSUNG
Executed: 2020-11-05
YEH, CHIA-LING
Executed: 2021-11-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Strain Relief Trenches for Epitaxial Growth
Application:
18/362,240 →
Publication:
US 2023/0377881