Patent Assignment
Reel/Frame 064440/0860
Assignment of Assignor's Interest
Recorded: 2023-07-31
Pages: 3
Assignors
HUANG, HSING-YUAN
Executed: 2023-04-24
LEE, CHIN-SZU
Executed: 2023-06-01
HO, YI CHEN
Executed: 2023-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Bonding Structures
Application:
18/313,786 →
Publication:
US 2024/0203923