Patent Assignment
Reel/Frame 064444/0972
Assignment of Assignor's Interest
Recorded: 2023-08-01
Pages: 6
Assignors
HIGASHIUCHI, TOMOKO
Executed: 2023-07-05
YOKOTA, HIROSHI
Executed: 2023-07-03
KOTAKE, TOMOHIKO
Executed: 2023-07-03
FURUKAWA, NAOKI
Executed: 2023-07-03
MARUYAMA, NAOKI
Executed: 2023-07-03
OKADA, YUTAKA
Executed: 2023-07-03
MATSUBARA, NOZOMI
Executed: 2023-07-04
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device Including Disposing an Adhesive Thermal Insulation Material on the Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.