Patent Assignment
Reel/Frame 064449/0161
Assignment of Assignor's Interest
Recorded: 2023-08-01
Pages: 6
Assignors
KIM, YOUNGWOO
Executed: 2023-02-07
PARK, YONGHAN
Executed: 2023-02-07
PARK, JIHO
Executed: 2023-02-10
SEONG, GEUMJUNG
Executed: 2023-02-20
HAN, SEUNGUK
Executed: 2023-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Integrated Circuit Device
Application:
18/355,520 →
Publication:
US 2024/0071771