Patent Assignment
Reel/Frame 064457/0362
Assignment of Assignor's Interest
Recorded: 2023-08-01
Pages: 4
Assignors
CHEN, YU-HAO
Executed: 2021-05-17
LEE, HUI-YU
Executed: 2021-05-20
WENG, CHUNG-MING
Executed: 2021-05-17
KUAN, JUI-FENG
Executed: 2021-05-17
WU, CHIEN-TE
Executed: 2021-05-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structures and Process Flow for Integrated Photonic-Electric Ic Package by Using Polymer Waveguide