Patent Assignment
Reel/Frame 064464/0911
Assignment of Assignor's Interest
Recorded: 2023-08-02
Pages: 7
Assignors
PARK, HWANJOO
Executed: 2023-07-02
KANG, SUNGGU
Executed: 2023-07-02
KIM, JAECHOON
Executed: 2023-07-02
KIM, TAEHWAN
Executed: 2023-07-02
MUN, SUNGHO
Executed: 2023-07-02
LEE, JONGGYU
Executed: 2023-07-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Package with Package-on-Package Semiconductor Chips
Application:
18/229,039 →
Publication:
US 2024/0055339