Patent Assignment
Reel/Frame 064471/0167
Assignment of Assignor's Interest
Recorded: 2023-08-02
Pages: 3
Assignors
LIN, MENG-HAN
Executed: 2021-02-03
HUANG, CHIA-EN
Executed: 2021-02-03
LIU, YI-CHING
Executed: 2021-02-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Common-Connection Method in 3D Memory