Patent Assignment
Reel/Frame 064471/0820
Assignment of Assignor's Interest
Recorded: 2023-08-02
Pages: 8
Assignors
KE, YU LUN
Executed: 2023-07-26
KUO, YU-WEI
Executed: 2018-01-07
CHIU, YI-WEI
Executed: 2017-11-07
CHANG, HUNG JUI
Executed: 2017-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Etch Profile Control of Interconnect Structures
Application:
18/362,248 →
Publication:
US 2023/0377963