IP Library › Assignment 064488/0199
Patent Assignment
Reel/Frame 064488/0199

Assignment of Assignor's Interest

Recorded: 2023-08-03 Pages: 4
Assignors
HUANG, BIN
Executed: 2023-02-27
CHEN, QIONGNAN
Executed: 2023-02-27
CHEN, HONGJI
Executed: 2023-02-27
GONG, CHUANQI
Executed: 2023-02-27
Assignee
DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
ROOM 801, BUILDING 1, NO. 1, YI LE ROAD, SONGSHAN LAKE PARK, DONGGUAN CITY, GUANGDONG PROVINCE, 523808, CHINA
Covered Property (1)
Connector Assembly with Improved Heat Dissipation Effect for Being Reliably Fixed to Circuit Board
Application: 18/229,339 →
Publication: US 2024/0248266