Patent Assignment
Reel/Frame 064496/0023
Assignment of Assignor's Interest
Recorded: 2023-08-04
Pages: 4
Assignors
AKIYAMA, JUN
Executed: 2023-06-19
KATO, YUJI
Executed: 2023-06-19
UENO, TAIKI
Executed: 2023-06-09
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Pressure-Sensitive Adhesive Sheet for Semiconductor Processing
Application:
18/358,791 →
Publication:
US 2024/0034914