Patent Assignment
Reel/Frame 064496/0382
Assignment of Assignor's Interest
Recorded: 2023-08-04
Pages: 5
Assignors
KONNO, SATOSHI
Executed: 2023-07-03
YAMAUCHI, SHINICHI
Executed: 2023-07-03
ANAI, KEI
Executed: 2023-07-03
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Conductive Composition for Bonding, Bonding Structure Using Same, and Manufacturing Method Thereof
Application:
18/275,891 →
Publication:
US 2024/0116104
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.