Patent Assignment
Reel/Frame 064504/0845
Assignment of Assignor's Interest
Recorded: 2023-08-07
Pages: 4
Assignors
CHEN, CHIEH-EN
Executed: 2023-07-03
LIN, CHEN-HSIEN
Executed: 2023-07-03
TING, SHYH-FANN
Executed: 2023-07-06
LIN, HSING-CHIH
Executed: 2023-07-03
YAUNG, DUN-NIAN
Executed: 2023-07-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Chip Including Through-Substrate via (Tsv) and Landing Structure
Application:
18/346,554 →
Publication:
US 2025/0014987