Patent Assignment
Reel/Frame 064516/0934
Assignment of Assignor's Interest
Recorded: 2023-08-08
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Including a Dielectric Layer Between a Source/Drain Region and a Substrate