Patent Assignment
Reel/Frame 064524/0966
Assignment of Assignor's Interest
Recorded: 2023-08-08
Pages: 3
Assignor
CHANG, JEN-YUAN
Executed: 2021-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stacked Semiconductor Device Including a Cooling Structure
Application:
18/446,076 →
Publication:
US 2023/0386957