Patent Assignment
Reel/Frame 064533/0214
Assignment of Assignor's Interest
Recorded: 2023-08-09
Pages: 3
Assignors
WANG, PING-WEI
Executed: 2023-08-06
CHANG, FENG-MING
Executed: 2023-08-03
CHEN, JUI-LIN
Executed: 2023-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structures for Integration of Memory Cells and Logic Cells