Patent Assignment
Reel/Frame 064553/0867
Assignment of Assignor's Interest
Recorded: 2023-08-10
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heterogenous Bonding Layers for Direct Semiconductor Bonding