IP Library › Assignment 064558/0407
Patent Assignment
Reel/Frame 064558/0407

Assignment of Assignor's Interest

Recorded: 2023-08-11 Pages: 3
Assignors
CHIOU, DE-YANG
Executed: 2021-05-12
YEN, FU-TING
Executed: 2021-05-12
PENG, YU-YUN
Executed: 2021-05-12
LIN, KENG-CHU
Executed: 2021-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Storage Layers For Wafer Bonding
Application: 18/447,968 →
Publication: US 2023/0387065
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 64558 Frame 407. Assignor(S) Hereby Confirms the Assignment. Feb 5, 2025
From: CHIOU, DE-YANG; YEN, FU-TING; PENG, YU-YUN; LIN, KENG-CHU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 070112/0756 →