Patent Assignment
Reel/Frame 064563/0133
Assignment of Assignor's Interest
Recorded: 2023-08-11
Pages: 3
Assignors
CHIU, CHIH-PIN
Executed: 2023-08-10
WU, YU-BEY
Executed: 2023-08-10
CHEN, DIAN-HAU
Executed: 2023-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Metal Ion Barrier Layers and Resulting Structures
Application:
18/448,407 →
Publication:
US 2024/0355766