Patent Assignment
Reel/Frame 064567/0070
Assignment of Assignor's Interest
Recorded: 2023-08-11
Pages: 3
Assignors
CHIOU, DE-YANG
Executed: 2021-05-12
YEN, FU-TING
Executed: 2021-05-12
PENG, YU-YUN
Executed: 2021-05-12
LIN, KENG-CHU
Executed: 2021-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Storage Layers for Wafer Bonding