IP Library › Assignment 064611/0566
Patent Assignment
Reel/Frame 064611/0566

Assignment of Assignor's Interest

Recorded: 2023-08-16 Pages: 15
Assignors
LEE, GEUN SU
Executed: 2023-06-29
SEONG, YEON HEE
Executed: 2023-06-29
JUNG, SUNG JAE
Executed: 2023-06-29
Assignee
LEE, GEUN SU
102-3601, 277, GWANGGYOHOSUGONGWON-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Photoresist Composition and Method of Forming Patterns Using the Composition
Application: 18/449,156 →
Publication: US 2024/0255848
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 16, 2023
From: KOH, CHAWON; NISHI, TSUNEHIRO; KOH, MOO HYUN; PARK, JI YOUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064611/0708 →
Assignment of Assignor's Interest Dec 9, 2025
From: LEE, GEUN SU
To: DCT MATERIAL LLC.
Reel/Frame 073163/0688 →