Patent Assignment
Reel/Frame 064624/0065
Assignment of Assignor's Interest
Recorded: 2023-08-17
Pages: 5
Assignors
CHIA, MENG-HUAN
Executed: 2021-08-18
JIANG, YIH-JENN
Executed: 2021-08-18
LIN, CHANG-FU
Executed: 2021-08-18
JIANG, DON-SON
Executed: 2021-08-18
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof