Patent Assignment
Reel/Frame 064629/0059
Assignment of Assignor's Interest
Recorded: 2023-08-17
Pages: 4
Assignors
JANG, SHU-UEI
Executed: 2023-08-13
WU, CHUNG-SHU
Executed: 2023-08-12
LIAO, YA-WEI
Executed: 2023-08-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6,, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/451,805 →
Publication:
US 2025/0063790