Patent Assignment
Reel/Frame 064629/0120
Assignment of Assignor's Interest
Recorded: 2023-08-17
Pages: 10
Assignors
LIAO, SHIH-HSIN
Executed: 2022-08-01
LIU, RUI-HONG
Executed: 2022-08-01
TSAUR, TAY-HER
Executed: 2022-08-01
LIN, PO-CHING
Executed: 2022-08-01
Assignee
REALTEK SEMICONDUCTOR CORP.
2 INNOVATION RD. II, SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method and Apparatus for Simulating Breakdown of Electronic Component