IP Library › Assignment 064635/0660
Patent Assignment
Reel/Frame 064635/0660

Assignment of Assignor's Interest

Recorded: 2023-08-18 Pages: 12
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-12-05
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Baffle Structure of the Substrate Processing Apparatus
Application: 17/375,784 →
Publication: US 2021/0343507
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 17, 2023
From: YANAI, HIDEHIRO; HIYAMA, SHIN; KAKUDA, TORU; SHIMADA, TOSHIYA
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 064624/0099 →