Patent Assignment
Reel/Frame 064655/0874
Assignment of Assignor's Interest
Recorded: 2023-08-22
Pages: 8
Assignors
MITSUKURA, KAZUYUKI
Executed: 2023-08-02
OTAKE, SHUNSUKE
Executed: 2023-08-03
FUJITA, HIROAKI
Executed: 2023-07-31
SHIMAOKA, SHINJI
Executed: 2023-07-31
MASUKO, TAKASHI
Executed: 2023-07-27
KURAFUCHI, KAZUHIKO
Executed: 2023-07-28
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Producing Semiconductor Device, Wiring Board, and Semiconductor Device
Application:
18/261,114 →
Publication:
US 2024/0088051
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.