Assignment of Assignor's Interest

Recorded: 2023-08-22 Pages: 4

Assignors

TOBA, MASAYA

Executed: 2023-08-01

YAMAGUCHI, MASAKI

Executed: 2023-07-27

MITSUKURA, KAZUYUKI

Executed: 2023-08-03

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Method for Producing Wiring Board, Laminate and Method for Producing Same

Application: 18/260,468 →

Publication: US 2024/0057263

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.