Patent Assignment
Reel/Frame 064663/0505
Assignment of Assignor's Interest
Recorded: 2023-08-22
Pages: 4
Assignors
CHANG, CHIA-HAO
Executed: 2020-09-24
HUANG, LIN-YU
Executed: 2020-09-24
YU, LI-ZHEN
Executed: 2020-09-24
CHUANG, CHENG-CHI
Executed: 2020-09-24
CHENG, KUAN-LUN
Executed: 2020-09-24
WANG, CHIH-HAO
Executed: 2020-09-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Air Gaps and Method of Fabrication Thereof