IP Library Assignment 064664/0730
Patent Assignment
Reel/Frame 064664/0730

Assignment of Assignor's Interest

Recorded: 2023-08-22 Pages: 18
Assignors
LIU, ZHI-GANG
Executed: 2023-07-18
JANG, JUN WOO
Executed: 2023-07-18
LEE, SEHWAN
Executed: 2023-07-21
KIM, DONGKYUN
Executed: 2023-07-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Cpu Tight-Coupled Accelerator
Application: 18/225,041 →
Publication: US 2024/0411599