Patent Assignment
Reel/Frame 064667/0796
Assignment of Assignor's Interest
Recorded: 2023-08-22
Pages: 4
Assignors
CHIU, YA-WEN
Executed: 2023-08-14
LIAO, DE JHONG
Executed: 2023-08-14
CHEN, YU-YU
Executed: 2023-08-16
CHEN, SZU-YING
Executed: 2023-08-14
PAN, ZHENG-YANG
Executed: 2023-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Gap Filling with Selectively Formed Seed Layer and Heteroepitaxial Cap Layer