Method for gap filling with selectively formed seed layer and heteroepitaxial cap layer
Embodiments of the present disclosure provide a method for selectively forming a seed layer over semiconductor fins. Some embodiments provide forming the selective seed layer using a mono-silane at an increased temperature. Some embodiments provide depositing a hetero-crystalline silicon cap layer over the bottom-up gap layer to improve gap filling and tune profiles of fin structures.
1 . A method for manufacturing a semiconductor device, comprising:
forming a first semiconductor fin structure and a second semiconductor fin structure;
forming a dielectric fin structure between the first and second semiconductor fin structures;
selectively forming a seed layer on the first and second semiconductor fin structures, wherein sidewalls of the dielectric fin structure remain exposed after formation of the seed layer;
depositing a sacrificial gate electrode layer over the seed layer and the dielectric fin structure;
forming a sacrificial gate structure from the sacrificial gate electrode layer;
forming sidewall spacers on the sacrificial gate structure;
etching the first and second semiconductor fin structures;
forming epitaxial source/drain regions;
removing the sacrificial gate structure; and
forming a replacement gate structure between the sidewall spacers.
2 . The method of claim 1 , wherein selectively forming the seed layer comprises:
depositing a silicon layer over the first and second semiconductor fin structures and the dielectric fin structure, wherein the silicon layer has a first growth rate on the first and second semiconductor fin structures and a second growth rate on the dielectric fin structure, and the first growth rate is different from the second growth rate.
3 . The method of claim 2 , wherein the sidewalls of the dielectric fin structure comprise SiCN.
4 . The method of claim 3 , wherein depositing the silicon layer comprises flowing a precursor comprises monosilane at a temperature between about 460° C. and about 480° C.
5 . The method of claim 2 , further comprising:
etching the silicon layer.
6 . The method of claim 5 , further comprising:
performing a surface treatment after etching.
7 . The method of claim 1 , wherein forming the sacrificial gate electrode layer over the seed layer and the dielectric fin structure comprises:
depositing a first silicon layer using a bottom-up deposition; and
depositing a cap layer over the first silicon layer.
8 . The method of claim 7 , wherein depositing the cap layer comprises:
depositing a first sublayer over the first silicon layer, wherein the first sublayer has a first crystalline structure; and
depositing a second sublayer over the first sublayer, wherein the second sublayer has a second crystalline structure different from the first crystalline structure.
9 . The method of claim 8 , wherein the first sublayer is an amorphous silicon layer and the second sublayer is a crystalline silicon layer.
10 . A method for manufacturing a semiconductor device, comprising:
forming a first semiconductor fin structure and a second semiconductor fin structures, wherein a first trench is formed between the first and second semiconductor fin structure;
forming a first silicon layer over the first and second semiconductor fin structures, wherein the first silicon layer is disposed in the first trench in a bottom-up manner;
depositing a first cap layer over the first silicon layer;
depositing a second cap layer over the first cap layer, wherein the first and second cap layers have different crystalline structures;
etching the first silicon layer, the first cap layer, and the second cap layer to form a sacrificial gate structure;
forming sidewall spacers on the sacrificial gate structure;
etching the first and second semiconductor fin structures;
forming epitaxial source/drain regions;
removing the sacrificial gate structure; and
forming a replacement gate structure between the sidewall spacers.
11 . The method of claim 10 , wherein the first cap layer is an amorphous silicon layer and the second cap layer is a crystalline silicon layer.
12 . The method of claim 10 , further comprising depositing a seed layer over the first and second semiconductor fin structures prior to forming the first silicon layer.
13 . The method of claim 12 , wherein the first and second semiconductor fin structures comprises germanium, and depositing the seed layer comprises depositing a silicon layer using a precursor comprising monosilane at a temperature range between about 460° C. and about 480° C.
14 . The method of claim 12 , further comprising forming a dielectric fin structure adjacent the first semiconductor fin structure, wherein a second trench is formed between the first semiconductor fin structure and the dielectric fin structure, and the seed layer is selectively formed on the first and second semiconductor fin structures.
15 . The method of claim 10 , wherein depositing the first cap layer comprises applying a first precursor at a first temperature, depositing the second cap layer comprises applying the first precursor at a second temperature, and the second temperature is higher than the first temperature.
16 . A method for manufacturing a semiconductor device, comprising:
forming two first fin structures, wherein a first trench is formed between the two first fin structures;
forming two second fin structures, wherein a second trench is formed between the two first fin structures;
forming a dielectric fin structure, wherein the dielectric fin structure is disposed between the first fin structures and the second fin structures, a third trench is formed between the dielectric fin structure and the first fin structure, and the third trench is narrower than the first and second trenches;
selectively forming a seed layer on the first and second fin structures, wherein sidewalls of the dielectric fin structure remain exposed after formation of the seed layer; and
forming a gap-fill silicon layer in the first, second, and third trenches.
17 . The method of claim 16 , wherein selectively forming the seed layer comprises:
depositing a silicon layer, wherein the silicon layer has a first growth rate on the first and second fin structures and a second growth rate on the dielectric fin structure, and the first growth rate is greater than the second growth rate; and
etching back the silicon layer to remove deposition from the dielectric fin structure.
18 . The method of claim 17 , wherein selectively forming the seed layer further comprises performing a surface treatment.
19 . The method of claim 16 , further comprising depositing a hetero-crystalline cap layer over the gap-fill silicon layer.
20 . The method of claim 16 , wherein forming the gap-fill silicon layer comprises cyclically performing a depositing process, an anneal process, and an etch process.