Patent Assignment
Reel/Frame 064669/0472
Assignment of Assignor's Interest
Recorded: 2023-08-22
Pages: 2
Assignor
CHOI, BYUNG-JIN
Executed: 2023-08-09
Assignee
CANON KABUSHIKI KAISHA
30-2, SHIMOMARUKO 3-CHOME, OHTA-KU, TOKYO, 146-8501, JAPAN
Covered Property
(1)
Method of Bonding Chips and a System for Performing the Method