Patent Assignment
Reel/Frame 064677/0715
Assignment of Assignor's Interest
Recorded: 2023-08-23
Pages: 6
Assignors
LEE, JONGGYU
Executed: 2023-03-07
KIM, JAECHOON
Executed: 2023-03-07
KIM, TAEHWAN
Executed: 2023-03-07
PARK, HWANJOO
Executed: 2023-03-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Application:
18/454,217 →
Publication:
US 2024/0079366