Patent Assignment
Reel/Frame 064685/0599
Assignment of Assignor's Interest
Recorded: 2023-08-23
Pages: 6
Assignors
GU, PENG
Executed: 2018-02-28
MALLADI, KRISHNA
Executed: 2018-02-28
ZHENG, HONGZHONG
Executed: 2018-02-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Hbm Silicon Photonic Tsv Architecture for Lookup Computing Ai Accelerator
Application:
17/873,120 →
Publication:
US 2022/0367412