Patent Assignment
Reel/Frame 064688/0306
Assignment of Assignor's Interest
Recorded: 2023-08-24
Pages: 6
Assignors
YIM, INBEOM
Executed: 2023-08-08
LEE, JEONGJIN
Executed: 2023-08-08
LEE, SEUNGYOON
Executed: 2023-08-08
HWANG, CHAN
Executed: 2023-08-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Device