Patent Assignment
Reel/Frame 064688/0322
Assignment of Assignor's Interest
Recorded: 2023-08-24
Pages: 5
Assignors
SUNG, JAEKYU
Executed: 2023-08-04
BAEK, JOONGHYUN
Executed: 2023-08-04
LEE, CHEOLWOO
Executed: 2023-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Application:
18/453,611 →
Publication:
US 2024/0179925