Patent Assignment
Reel/Frame 064695/0255
Assignment of Assignor's Interest
Recorded: 2023-08-24
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Brush Assembly and Wafer Cleaning Device Including the Same
Application:
18/237,547 →
Publication:
US 2024/0290637