IP Library › Assignment 064704/0670
Patent Assignment
Reel/Frame 064704/0670

Assignment of Assignor's Interest

Recorded: 2023-08-24 Pages: 4
Assignors
TAI, YU SHU
Executed: 2023-07-25
LI, CHIH-CHENG
Executed: 2023-07-19
Assignees
INVENTEC (PUDONG) TECHNOLOGY CORPORATION
NO.789, PUXING ROAD, MIN HANG DISTRICT, SHANGHAI, CHINA
INVENTEC CORPORATION
NO. 66, HOU-KANG STREET, SHIH-LIN DIST., TAIPEI CITY, TAIWAN
Covered Property (1)
Shielding Cover and Circuit Board Assembly
Application: 18/236,891 →
Publication: US 2024/0407144