Patent Assignment
Reel/Frame 064707/0644
Assignment of Assignor's Interest
Recorded: 2023-08-25
Pages: 3
Assignors
HUANG, YEN-CHIH
Executed: 2023-08-21
SUN, LI-AN
Executed: 2023-08-22
CHEN, CHIH-HAO
Executed: 2023-08-21
HUANG, CHUNG-CHUAN
Executed: 2023-08-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/238,049 →
Publication:
US 2025/0069989