Patent Assignment
Reel/Frame 064712/0912
Assignment of Assignor's Interest
Recorded: 2023-08-27
Pages: 3
Assignor
CHEN, HOWARD E.
Executed: 2023-05-22
Assignee
SKYWORKS SOLUTIONS, INC.
5260 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property
(1)
Dual Sided Molded Package with Varying Interconnect Pad Sizes and Varying Exposed Solderable Area